intech-2000

high speed, reel to reel, pure indium

the intech -2000 is a high-speed, high efficiency, stable electroplating system designed for the rapid deposition of pure indium at a wide range of current densities.

m-contact intech-2000 offers the advantage of being a pure indium, lead-free, plating process

providing an ultra-soft deposit that yields a uniform grain size, which is an excellent alternative   to reduce the tendency for whisker growth. the process results in uniform, matte white deposits over a very wide cathode current density range. the resulting deposits h**e excellent reflow properties and are great for press fit applications.

intech -2000是一种高速、高效、稳定的电镀系统，专为在广泛的电流密度下快速沉积纯铟而设计。 intech  -2000具有纯铟无铅电镀工艺的优势，提供超软镀层，产生均匀的晶粒尺寸，这是减少晶须生长趋势的绝佳选择。该工艺在极宽的阴极电流密度范围内产生均匀的哑光白色沉积   物。所得到的沉积物具有优异的回流性能，对压滤效果很好。

read entire technical data sheet before using this product

在使用本产品之前，请阅读完整的技术说明书

features 特性

benefits 优点

operates over a wide current density range

在宽电流密度范围内工作

uniform plating thickness regardless of part geometry

镀层厚度均匀，不考虑零件几何形状

analyzable additives

可分析的添加剂

easy to maintain and control

易于维护和控制

simplified effluent treatment

简化污水处理

environmentally friendly process

环保工艺

high efficiency

效率高

consistent plating rate throughout the  life  of the bath

在镀液的整个使用寿命中保持一致的镀速